pattern plating, plated through hole, nickel/gold plating, immersion gold, and outline by CNC drilling, CNC routing, punching, V-cut, and finishing by Wet Film Solder Mask, Preflux, Hot Air Leveling, and Entek. 

All boards can be checked by Electrical Open Short E-test, and vacuum packed for customer assigned shipment location.   SMT and fine-line 4/4 mil line/width spacing techniques in production by dry film imaging is employed.